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Abstract
Line-type Cu/Sn/Ni and Cu/Sn/Ni-P interconnects as well as real Ni/Sn3.0Ag0.5Cu/Cu and Ni/Sn3.0Ag0.5Cu/Ni-P flip chip solder joints were comparatively studied to reveal the electromigration reliability of solder joints. The experimental results of the line-type solder interconnects showed that Cu could diffuse to the opposite anode Ni interface and change the interfacial IMC type while Ni could not change IMC type at the opposite anode Cu interface under a current density of 1×104A/cm2 at 150 oC. In real flip chip solder joints, the EM life of Cu (OSP) solder joints was significantly longer than that of Ni-P (ENEPIG) solder joints. A higher Cu content in the solder bumps effectively improved the electromigration resistance of solder joints. This work provides a suggestion for optimizing the structure of flip chip solder joints.
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