Abstract
In this study, a highly reliable Ag sinter joining on Direct bonded aluminum (DBA) substrate was introduced in SiC power modules. The electroless nickel /electroless palladium/immersion gold (ENEPIG) metallization layer was coated on the DBA substrate with the electroless nickel layer of 7µm and 20 µm. The reliability of SiC/DBA die-attached module by Ag sinter joining was evaluated by thermal shock test (TST) from -50℃ to 250℃ up to 1000 cycles. In the case DBA with the Ni metallization layer of 7µm, severe ups and downs deformation occurred from the Al layer during the TST, leading to uneven variation of sintered Ag layer. The deformation was suppressed when the Ni layer increased to 20 µm. The bonding interface and fracture characteristics were systematically investigated for the both cases, which provide basic understanding the Ag-Au reliability by the design for the metallization layer on substrate.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call