Abstract
Fan-out WLP is one of embedded package processed on wafer level, also a key advanced packages with higher number of I/Os, integration flexibilities. Furthermore, it enables to integrate multiple dies vertically and horizontally in one package without using substrates. Thus, recently Fan-out WLP technology is moving forward to next generation packages, such as multi-die, low profile package and 3D SiP. Not only the electronic packages, Fan-out WLP but also is used for sensor, power IC and LED packages This paper reports developments of next generation Fan-out WLP for advanced packaging solutions.
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