Abstract
The technology of chemical mechanical polishing (CMP) continues to evolve in multiple dimensions. As one of the key enabling processes for advanced digital devices, such as microprocessors and high-speed memory, CMP is expected to deliver surfaces that are planarized flat and smooth to insanely small dimensions (below 3 nm) while also avoiding even the smallest micro-scratches and without leaving a trace of unwanted residue. These applications also involve tuning the selectivity between two or more different materials to enable topography control at the nanoscale level. CMP also plays a key role in many other emerging markets, such as certain MEMS devices, SiC substrates for power devices, and many more. Examples and information from numerous sources will be combined to provide a wide view of the CMP market and to highlight several trends which have both technical and commercial implications for the near future.
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