Abstract
Investigations of the sputtering of films of the Pb1 − xSnxTe ternary solid solution with 0 ≤ x ≤ 1 in RF high-density low-pressure inductively coupled argon plasma have been performed. The effect of a constant sputtering rate with variation in the composition of the semiconductor solid solution for (111)-oriented films with x 0.6 is found. The results are analyzed in the context of a model of ternary alloy sputtering based on the Sigmund solid sputtering theory when taking into account the sublimation energies of binary compounds that constitute a solid solution.
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More From: Journal of Surface Investigation. X-ray, Synchrotron and Neutron Techniques
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