Abstract
Surface mount technology imposes severe strains on plastic leaded chip carriers. An examination of package cracking during solder reflow and the factors that affect this problem are presented. The major factor inducing package cracking is found to be water vapor absorption from the ambient. It was found that the cracking problem could be circumvented by reducing the absorbed moisture level through a minimum 6 h 150°C air bake followed by surface mounting within 8 h to prevent reabsorption of water from the environment. Other factors affecting this problem are the absorptivity of the plastic encapsulant, the plastic brittleness, the rigidity of the lead frame flag, the plastic to lead frame bond strength, the package thickness, and the die size.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
