Investigations of double layer UV-curing resin diamond wire saw

Abstract

In view of poor resin flexibility and easy to fall off of diamond grits during manufacturing process of single layer UV-curing resin diamond wire saw, a novel manufacturing approach of double layer UV-curing resin diamond wire saw is put forward. During the manufacturing process, a layer of UV-curing resin with a good pliability and strong binding ability is uniformly coated on the core wire surface, then it is cured by the UV light. After that, a layer of UV-curing resin containing diamond grits is coated on the wire surface coated with resin. Another curing is conducted by the UV light. Then the double layer UV-curing resin diamond wire saw is manufactured. The cutting experiments of single and double layer UV-curing resin diamond wire saw are performed for silicon ingot at a single wire sawing machine. Experimental results show that the cutting efficiency of double layer UV-curing resin diamond wire saw is up to 26mm2/min. Compared with single layer UV-curing resin diamond wire saw, lower kerf loss and damage are found, which means a higher utilizing rate of silicon material is achieved. Surface roughness reduces from Ra4.595µm to Ra1.031µm. The cutting performance of double layer UV-curing resin diamond wire saw improves significantly.