Abstract
Three-dimensional transparent wafer structures can be modelled best using BPM. Then the image intensities are calculated for three waveleghths to discuss the colour properties in the image. Additionally the influence of sampling is analysed for CD- and overlay measurement by the help of simulated test wafer structures.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
