Investigation on the stress corrosion cracking behavior and mechanism of 90/10 copper-nickel alloy under the cooperative effect of tensile stress and Desulfovibrio vulgaris

Abstract

The proposed study aimed to examine the impact of stress on the microbiologically influenced corrosion (MIC) behavior of a 90/10 copper-nickel (Cu-Ni) alloy using a self-made three-point bending device in the Desulfovibrio vulgaris inoculation system. The corrosion rate of alloy under plastic deformation was higher compared to elastic deformation, leading to the initiation of more severe cracks as well as the emergence of numerous secondary cracks at the bottom of the primary cracks. The stress played a vital role in strengthening the alloy's MIC process. A comprehensive mechanism for stress-assisted 90/10 Cu-Ni alloy MIC by D. vulgaris was proposed.