Investigation on the mechanism of steel/steel solid-state bonding at low temperatures

Abstract

The solid-state bonding of ultralow-carbon steels was conducted by hot pressing and subsequent isothermal holding at low temperatures ranging from 873 to 923 K. The evolution of the interfacial strength was found to consist of two stages; the first stage, where the increase in interfacial strength is rapid and significant, and the second stage, where the increase is gradual. The evolution of strength in the first stage primarily takes place in contact regions produced by hot pressing. In the second stage, on the contrary, the evolution seems to result from the increase in the contact regions due to the shrinkage of voids. A molecular dynamics simulation was performed to clarify the atomic behaviour at the interface during the first stage. The results revealed that the disordered atomic arrangement caused by compression was rearranged with increasing isothermal holding time, leading to improved coherency between the contact regions and increased interfacial strength.