Investigation on the machinability of copper-coated monocrystalline silicon by applying elliptical vibration diamond cutting

Abstract

Although monocrystalline silicon exhibits promising microstructural properties for enhancing the performance of optical systems, precise and efficient silicon fabrication is still challenging due to its brittleness. In the present work, we demonstrate the ductile machinability of copper-coated silicon by applying elliptical vibration diamond cutting. Firstly, the influence of the copper coating on the ductile machinability of silicon was experimentally investigated by applying ordinary diamond cutting, showing that the critical depth of cut (DOC) for the ductile-to-brittle transition increased from 118 to 418 nm due to the advantages of the copper coating. This provided hydrostatic pressure in the microcutting regime and the compressive force on the subsurface defects to prevent crack propagation. Subsequently, grooving tests on coated and uncoated silicon were performed by applying elliptical vibration cutting (EVC). Due to the small instantaneous uncut chip thickness in each vibration cycle, the critical DOC by EVC for uncoated silicon increased to 459 nm. Applying the favorable copper coating process, the critical DOC by EVC for coated silicon increased to about 988 nm. The ductile machinability of silicon was efficiently improved by combining EVC and the coating process. Furthermore, the influence of vibration amplitude and cutting speed on the ductile machinability of silicon was explored in detail, leading to the optimized machining conditions for the ductile machining of silicon. Finally, based on these fundamental results, ultra-precision microlenses on silicon were efficiently fabricated, which is appropriate for further industrial applications.