Investigation on out-of-plane displacement measurements of thin films via a mechanical constraint-based 3D-DIC technique

Abstract

Thin film is functioning as a key material in surface engineering, and accurate measurement of its deformation are particularly important for the reliability and stability assessment of coating-substrate structures. However, the displacement field measured by the conventional three-dimensional subset-based digital image correlation (3D-DIC) method has no spatial continuity; thus, it cannot precisely reflect the true deformation of thin films. To improve the measurement accuracy, a 3D-DIC method considering mechanical constraints (3DMC-DIC) was proposed in this paper. In this method, a mesh with 8-noded quadrilateral shell elements satisfying spatial continuity was employed to determine the out-of-plane displacements of all nodes based on trusted points, which are the speckle points with higher measurement accuracy obtained by the conventional subset-DIC method. The whole out-of-plane displacement field was then inversely obtained based on the optimized displacements of these nodes. A blister test was performed, and the results show that the out-of-plane displacement field of thin film with spatial continuity and high accuracy on specimen edge can be obtained by the 3DMC-DIC method.