Investigation on 4H-SiC gate turn-off thyristor with direct carrier extraction access to drift region for power conversion applications

Abstract

4H-SiC gate turn-off (GTO) thyristor offers extraordinary advantages over its counterparts in handling ultra-high voltage electric power conversion applications because of its relatively low forward voltage drop at high conduction current density. Besides, though the SiC thyristors never suffer from long carrier liftime induced large switching loss like Si thyristors, the peak temperature rise rather than dynamic avalanche breakdown is blamed for the safe operation area (SOA) failure, making further reduction of power loss in SiC GTOs even more important. In this paper, a 20 kV SiC GTO with direct carrier extraction access to its drift region (DA-GTO) is investigated to explore the benefit this structure could bring for SiC thyristors, namely achieving smaller switching loss and/or potential larger SOA with slight sacrifice in forward voltage drop at high current. The structure is formed by interleaved P+ ion implantation into part of the thin N-injector layer based on conventional 20 kV SiC GTO. The SiC DA-GTO operates in BJT mode at low current, and in GTO mode with low forward voltage drop at high current. During turn-off process, it offers a direct current path to quickly sweep out the excess carriers in the P-drift region, thus speeds up the turn-off process and decreases the turn-off loss. Simulation results show that its turn-off loss reduces by 37.4%, contributing to 12.6% reduction in total power loss, compared with SiC GTO. Therefore, SiC DA-GTO is a very promising choice for next-generation power conversion systems.