Investigation of Trenched and High Temperature Annealed 4H-SiC

Abstract

This study focuses on the effects of a high temperature anneal after dry etching of trenches (post-trench anneal, PTA) on 4Hsilicon carbide (4H-SiC). We aim at the optimum 4H-SiC post-trench treatment with respect to the fabrication and the operation of a trenched gate metal oxide semiconductor field effect transistor (Trench-MOSFET). PTA significantly reduces micro-trenches, also called sub-trenches [, in the corners of the bottom of the trench. This is highly beneficial in case the etched trench sidewall is used as the channel of a Trench-MOSFET. However, PTA is also shown to cause a slight enlargement of the trench width along with a considerable increase of the substrate surface roughness. In addition, X-ray photoelectron spectroscopy (XPS) depth profiles indicate an increased carbon atom concentration at the 4H-SiC surface after the high temperature PTA. The non-stoichiometric surface composition affects the quasi-static capacitance-voltage (QSCV) behavior of MOS structures using a deposited gate oxide (GOX). We assume that a sacrificial oxidation directly after the PTA could restore a stoichiometric 4H-SiC surface.