Investigation of the Thermal Loading and Random Vibration Influences on Fatigue Life of the Solder Joints for a Metal-Oxide-Semiconductor-Field-Effect Transistor in a DC-DC Power Boost Converter

Songgang Li,Umashankar Subramaniam,Guobiao Yang,Davood Ghaderi,Niloufar Rajabiyoun

doi:10.1109/access.2020.2985320

Abstract

This study presents the effects of the vibration and thermal cycling on the fatigue life of a power Metal Oxide Semiconductor Field Effect Transistor (MOSFET) in a power converter circuit. The fatigue mechanism in per loading mode was investigated separately and based on the overlap approach, the synchronous effects were analyzed. The solder creeps’ attitudes are depended on the fatigue life for the thermal loops. The success of the deposited strain per thermal loop is in direct relation with the fatigue lifetime. The main source of the stress in the packaging process is the differences between the components’ thermal coefficients. To evaluate the effects of the vibration on the fatigue life for the solder layers, the RMS value of the peeling stress was considered. According to the results, the maximum stress and main affected points realized at the corners of the layers. It has been identified that the assembling of the thermal effects and mechanical loads are quickened the failure rate at the solder joints for this device. The Finite Element Method (FEM) is used for the simulation and the results confirm the estimated crack formation places in the layers.

Highlights

Power electronics applications and designs widely are expanding based on their inevitable role in Renewable Energy Sources (RESs), industries and aerospace implementations to transmit the power to the load side [1], [2]
This study presents the effects of the vibration and thermal cycling on a SnAgCu (SAC) type of the solder joints for a power switch in a DC-DC Power Boost Converter separately and the combined effects of these parameters is analyzed
The accumulated creep stain introduced as the most important parameter of the solder failure for the thermal cycling and the maximum peeling stress presented as the main factor of the fatigue failure for the random vibration

Summary

Introduction

Power electronics applications and designs widely are expanding based on their inevitable role in Renewable Energy Sources (RESs), industries and aerospace implementations to transmit the power to the load side [1], [2]. The thermal cycling and random vibration have been analyzed separately as two different parameters for the power modules and the fatigue investigation of the solder joints in the modules under the simultaneous influences of these parameters need to be presented because normally these parameters are applied at the same time especially for the moving systems.

Results

Conclusion