Abstract
The Capillary UnderFill (CUF) process is already widely applied in flip-chip packaging since it significantly improves the solderjoint reliability. However, in the FC package, voids have always been around in the CUF package process, which is a problem that needs further investigation. This study focuses on the underfill flow behavior of an FC module with a bump array design. In this paper, the computational fluid dynamics simulation with a three-dimensional model was developed to analyze the flow behavior of underfill, and the parameters that affect the capillary flow situation were studied in the mold flow analysis, including contact angle, surface tension, dispense pattern, the viscosity of underfill, and mold temperature. The simulation resulted a proper understanding of the actual situation and through observing the melt front flow, we could predict the void movement trend and the exact locations and sizes of the voids. The analysis showed that these parameters mentioned above strongly influenced the mold flow and air trap location. The simulation analysis helps select underfill with optimal mold parameters and material properties for the molding process.
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