Effect of flip-chip ball grid array structure on capillary underfill flow

Abstract

During the capillary underfill (CUF) process in flip-chip packaging, issues like incomplete filling, voids, wire sweeping, and overflow can impact product reliability and the relatively long filling time required. Therefore, finding ways to improve filling efficiency is a critical challenge. Conducting experiments to address these issues can be costly. As a result, the industry often relies on simulation software to simulate the actual manufacturing process, predict potential problems, compare results with experimental data, and analyze ways to improve the process. This approach helps enhance the package yield and further improves production efficiency.This study investigates the capillary underfill (CUF) process through simulation. Firstly, the viscosity and reaction kinetics of the underfill material are measured to establish the necessary data for the simulation. Then, Moldex3D, a mold flow simulation software, is used to create the model, generate the mesh, and perform the process simulation analysis. The effects of material properties and process parameters on the capillary underfill process are considered. The simulation results are compared with experimental data to validate the feasibility of the simulation. Subsequently, different flip-chip package structures and CUF process parameters are analyzed through simulation to explore the impact of these parameters on the flow pattern and filling efficiency of the adhesive material during the filling process.According to the simulation results, the filling speed is faster when the bump pitch and gap height are larger. However, the required filling time still has a considerable relationship with the volume of the filling region. Dispensing from the side with lower bump density can shorten the filling time when the bump distribution is uneven.