Abstract
We studied the occurrence of supply current spikes and destructive events in NAND flash memories under heavy-ion exposure. In addition to broad-beam experiments, we used collimated beams and ion-electron emission microscopy to investigate the phenomena on two types of memories with different feature size. Current spikes on the supply current were observed in both devices, also with collimated beams, whereas destructive events occurred only with broad beam. We show that current spikes do not originate from charge-pump capacitors, as previously suggested, and propose that destructive events are due to the effects of temporally close heavy-ion hits on distinct areas of the tested chips.
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