Abstract

We have investigated the unintentional n-type background doping in GaN(0001) layers grown on semi-insulating 4H-SiC(0001) substrate by plasma-assisted molecular beam epitaxy under Ga-rich conditions at growth temperatures from 780°C and 900°C. All layers exhibited very smooth surface morphology with monolayer steps as revealed by atomic force microscopy. Hall-effect measurements showed that the sample grown at 900°C had carrier concentration of 9.8 × 1017 cm−3 while the sample grown at 780°C had resistivity too high to obtain reliable measurements. Secondary-ion mass spectroscopy revealed O and Si concentrations of <1017 cm−3 in the sample grown at 900°C but >1017 cm−3 in the sample grown at 780°C. The trend for the atomic concentrations of O and Si, which are common donor impurities in GaN, was thus contrary to the trend of the carrier concentration. The full-width at half-maximum for x-ray rocking curves obtained across the GaN(0002) and GaN(10 bar{1} 5) reflections for the sample grown at 900°C was 62 arcsec and 587 arcsec, respectively. The half-width increased with decreasing growth temperature. The atomic concentrations of O and Si are too low to account for the unintentional background doping levels. A possible explanation proposed in early reports for the background doping is N-vacancies.

Highlights

  • It is well known that GaN exhibits unintentional n-type background doping

  • We studied the impact of Si and O impurities on the unintentional n-type background doping concentration in GaN layers grown under Ga-rich conditions by plasma-assisted molecular beam epitaxy (MBE)

  • The GaN/SiC samples were cleaved after growth, and the thickness of each layer was measured from cross-sectional scanning electron microscopy (SEM) images of the cleaved sample edge, obtained using a Zeiss Ultra 55 FEG SEM

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Summary

INTRODUCTION

It is well known that GaN exhibits unintentional n-type background doping. In epitaxial GaN layers, this n-doping concentration is typically between mid 1016 cmÀ3 and high 1017 cmÀ3. High doping concentrations of both n-type and p-type layers are critical for many (Received July 20, 2016; accepted March 28, 2017; published online April 6, 2017). We studied the impact of Si and O impurities on the unintentional n-type background doping concentration in GaN layers grown under Ga-rich conditions by plasma-assisted molecular beam epitaxy (MBE). Our results suggest that the studied impurities cannot be the cause of the unintentional n-type doping in our GaN layers

EXPERIMENTAL PROCEDURES
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DISCUSSION AND CONCLUSIONS
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