Investigation of reactive ion etching of dielectrics and Si in CHF3∕O2 or CHF3∕Ar for photovoltaic applications

Abstract

Using a combination of etch rate, photoconductance, and deep level transient spectroscopy (DLTS) measurements, the authors have investigated the use of reactive ion etching (RIE) of dielectrics and Si in CHF3∕O2 and CHF3∕Ar plasmas for photovoltaic applications. The radio frequency power (rf-power) and gas flow rate dependencies have shown that the addition of either O2 or Ar to CHF3 can be used effectively to change the etch selectivity between SiO2 and Si3N4. The effective carrier lifetime of samples degraded upon exposure to a CHF3-based plasma, reflecting the introduction of recombination centers in the near-surface region. The extent of minority carrier lifetime degradation was similar in both types of plasmas, suggesting that the same defects were responsible for the increased recombination. However, the rf-power dependence of lifetime degradation in n- and p-type Si was different. Moreover, the lifetime degradation did not exhibit a linear rf-power dependence, suggesting that primary defects were not the dominant recombination centers responsible for the decrease in lifetime. Indeed, DLTS measurements have shown that secondary defects were formed in samples exposed to the plasma after annealing at 400°C, the temperature at which a SiN:H layer is deposited on samples to passivate their surfaces. The minority carrier lifetime degradation in RIE processed samples could be partially avoided using post-RIE chemical treatments.