Abstract
In this case study we present the failure analysis flow of a MEMS device. Because of the combination of a MEMS sensor and ASIC die within one package (system in package) new materials are used. This causes new failure modes and creates particular failure analysis challenges. In this particular case study, contamination due to glob top on the ASIC die causes reliability problems. The change of mechanical stress within the package then leads to open bonds causing functional fails in the field application. To determine the root cause of the problem multiple steps of selective decapsulation are necessary as shown in this study in detail.
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