Abstract

GaN high electron mobility transistors were fabricated and investigated in detail to improve their linearity at high operating voltage. The scheme of dual-threshold (DT) coupling was adopted to mitigate the transconductance (G m) nonlinearity and a multi-fingers drain field plate (MF-DFP) was employed to alleviate the high electric field. The proposed GaN HEMT, integrating the DT technique (DT HEMT) and MF-DFP structure (DT HEMT W/ MF-DFP), yielded a G m plateau of ∼5.5 V and a ∼8 dB improvement in the calculated output third-order intercept point(OIP3) than that of DT HEMT. The load-pull measurements at 30 GHz delivered a peak power-added efficiency (PAE) of 52.5 % at V ds = 10 V, and saturation output power density (P out) of 5.5 W mm−1 at V ds = 20 V. In comparison with the DT HEMT, the DT HEMT W/ MF-DFP obtained a flatter gain profile, with ∼1.5 dB improvement in gain compression at V ds = 20 V.

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