Abstract

We have manufactured oxide field-effect transistors using the electron system at the LaAlO3-SrTiO3 interface as a drain-source channel and measured the devices under a hydrostatic pressure of up to 1.8 GPa. These studies of oxide transistors in the high-pressure regime demonstrate remarkable stability of the devices against gate leakage and resilience to mechanical strain. They show that oxide transistors can be operated in a wide range of pressures and temperatures and open the road for future studies of oxide materials and their possible applications in electronics.

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