Investigation of heat transfer performance for through-silicon via embedded in micro pin fins in 3D integrated chips

Abstract

Thermal management of 3D integrated chip (IC) with through silicon vias (TSV) is critical to achieving optimal overall system performance. In this work, the electrothermal coupling effect of TSV in micro pin fins embedded in a 3D IC was numerically investigated with deionized water as the coolant. The effects of various parameters, including the layouts of micro pin fin and TSV, TSV diameter, oxide thickness, and pin fin structures, on electrothermal coupling behaviors were analyzed. The results indicate that increasing TSV diameter, voltage loading of TSVs, and oxide thickness leads to higher temperature peaks and greater temperature differences between TSVs and pin fins. A C-shaped layout for the TSV and micro pin fins was found to facilitate heat transfer. And the best comprehensive heat transfer performance was achieved with an extended fin angle of 30 degrees for the micro pin fins. The findings contribute to the development of effective thermal management strategies for 3D ICs with TSVs, highlighting the importance of considering various parameters when designing micro pin fins and TSV layouts to optimize electrothermal coupling behaviors.