Investigation of forming process for micro‐socket connecters

Abstract

The development of micro‐electro‐mechanical systems (MEMS) and micro system technology (MST) has improved the development of micro manufacture technologies such as microforming. In this investigation, the micro‐socket connecter was selected as the forming target since it is widely used in micro electronic industries. The forming scheme of micro‐socket connecters was investigated from the viewpoint of three procedures: blanking the contour and locating hole, blanking the socket and the bending process. The forming experiments were performed with T2 copper foil of 0·08 mm thickness. The effects of punch speed and grain size on the maximum punch force, bending force, cross‐sectional quality and springback angle were studied in detail. The results show that the maximum punch force decreases with the increase in punch speed and grain size. However, the maximum punch force increases slightly with the increase in grain size in the blanking socket procedure. The smoothly sheared area ratio becomes smaller with the increase in punch speed and grain size. The punch speed has a negative effect and grain size has a positive effect on springback angle. Analysis was carried out by considering the polycrystalline structure of the metallic material.