Abstract
Nonconductive adhesive/nonconductive film (NCA/NCF) bonding technology has attracted increasing research interests as lead-free interconnect. During bonding, heat and pressure are applied and the direct physical contacts between the two surfaces of integrated circuit bump and substrate bond pad can be achieved. The electrical contact resistance of a NCA/NCF joint is controlled by the pressure, roughness and NCA/NCF material properties. An accurate prediction of contact resistance can help guide experiment setup towards improving the electrical performance of NCA/NCF. In this study, a model is developed and correlated to experiments. The effects of NCA/NCF material properties on electrical contact resistance are investigated.
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