Abstract

Dilute GaAsN layers are grown by liquid phase epitaxy (LPE) technique, using polycrystalline GaN as the source of nitrogen. A band gap lowering of 100 meV is obtained from low temperature photoluminescence (PL) measurements which correspond to a little more than 0.5% nitrogen in the layer. Using 10 K photocapacitance measurements, a 0.7 eV electron trap is detected in the material which is assigned to an interstitial (N–N) As defect. Annealing of the material at 750 °C for 1 h greatly reduced this trap and new electron traps with activation energies of 0.8 and 0.9 eV are detected. These new traps are suggested to be due to individual nitrogen-related defect complexes, produced by the thermal annihilation of the N–N bond. After a high temperature treatment of the GaAsN growth melt with 0.1 wt.% Er, nitrogen is found to be removed from the layer and no electron trap was detected.

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