Abstract

Wearable electronics are new structures with a wide range of possible applications. This study aims to analyze the effects of hot pressing in thermal transfer of different carbon-based composites as a new application method of screen-printed electronics on textiles. Flexible heaters were screen-printed on polyethylene terephthalate PET foil with composites based on graphene, carbon black, and graphite with different wt.%, measured and then hot pressed to measure and analyze differences. Research showed that the hot pressing process in thermal transfer resulted in decreased electrical resistance, increased power, and higher maximal temperatures. Best results were achieved with composites based on 12 wt.% graphene with sheet resistance lowered by about 40% and increased power by about 110%. This study shows promise for thermal transfer and screen-printing combination as an alternative for creating flexible electronics on textiles.

Highlights

  • Driven by marketing, trends among the youth, and high capital, wearable electronics are becoming one of the most popular and highly discussed topics [1]

  • Offered products already evolved beyond medical purposes, entering a sphere of commercial, entertainment, or industrial applications [2]

  • Due to a need to monitor patients over prolonged periods and sometimes even do it remotely [3], wearable electronics moved from carried elements to integrated electronics

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Summary

Introduction

Trends among the youth, and high capital, wearable electronics are becoming one of the most popular and highly discussed topics [1]. Many companies are already in this market, offering smartwatches, pulsometers, smart bands, and other smart accessories. With an increase in demand, research and development of those technologies became more focused. The development of digital medicine was one of the most important driving factors behind this change. Due to a need to monitor patients over prolonged periods and sometimes even do it remotely [3], wearable electronics moved from carried elements to integrated electronics. Those new devices must be flexible, convenient to use, miniaturized, and even aesthetically appealing

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