Abstract

It is always an important issue to open the energy gap for graphene while retaining its high carrier mobility. Narrowing down large-area graphene into graphene nanoribbons (GNRs) is one of the ways to open the energy gap to achieve field-effect transistors (FET) suitable for logic circuits. But it has been a problem to obtain GNRs with controllable width and specific boundary structure. In this work, we proposed a simple high-precision preparation method for GNRs. In the process, GNRs with a width of 200 nm and smooth edges were prepared by a focused ion beam (FIB) etching process. Graphene nanoribbon field-effect transistors (GNR-FET) were fabricated by electron beam lithography (EBL). In this device, due to the proximity of the edge of the He+ during the FIB etching process, the carbon atom structure of the GNRs edge was changed, resulting in variations in electron transport properties. The electrical performance test demonstrated that the on/off current ratio of the GNR-FET device was up to 103 at room temperature. The structural defects of the GNRs caused the device carrier mobility down to 371.6 cm2V−1s−1. The structural defects in the GNRs edge introduced by FIB can improve the on/off current ratio of the device and hence enhanced its electrical regulation performance. Our work provides a simple method of making controllable GNRs to fabricate field effect transistors.

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