Abstract
The three layers of structure NiCr/NiSi film thermocouples (TFTCs) were deposited onto the glass substrate by the direct current pulsed magnetron sputtering technique. The hot junctions of three TFTCs were overlapped. Between the hot junctions, SiO2 insulation films were deposited. Then, the heat conduction between TiO2 film and substrate was investigated. The results showed that at the initial stage of TiO2 film growth, the electromotive force (EMF) of top TFTC was higher than that of middle TFTC. EMF difference between top and middle TFTCs increased with time. Meanwhile, EMF of bottom TFTC was also higher than that of middle TFTC. EMF difference between bottom and middle TFTCs increased with time. Until the critical time, the middle TFTC received the heat conduction from TiO2 film and substrate. At the critical time, EMF difference between top and middle TFTCs, as well as between bottom and middle TFTCs, reached the maximum, which meant the heat conduction equilibrium state between top, middle, and bottom TFTCs. Then, because of the heat conduction from hot junction to pads of TFTCs, EMF difference between top and middle TFTCs, as well as between bottom and middle TFTCs, both decreased with time.
Published Version
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