Introduction

Abstract

Shrinking device geometry, growing chip area and increased data-processing speed performance are technological trends in the integrated circuit industry to enlarge chip functionality. Already in 1965 Gordon Moore predicted that the total number of devices on a chip would double every year until the 1970s and every 24 months in the 1980s. This prediction is widely known as “Moore’s Law” and eventually culminated in the Semiconductor Industry Association (SIA) technology road map [1]. The SIA road map has been a guide for the industry leading them to continued wafer and die size growth, increased transistor density and operating frequencies, and defect density reduction. To mention a few numbers; the die size increased 7% per year, the smallest feature sizes decreased 30% and the operating frequencies doubled every two years. As a consequence of these trends both the number of transistors and the power dissipation per unit area increase. In the near future the maximum power dissipation per unit area will be reached.KeywordsPower DissipationComplementary Metal Oxide SemiconductorComplementary Metal Oxide Semiconductor TechnologySemiconductor Industry AssociationComplementary Metal Oxide Semiconductor ProcessThese keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.