Abstract

Electroless copper deposition using formaldehyde as a reducing agent at 60 °C is widely used in commercial printed circuit board industries. However, formaldehyde, as a carcinogen, has high potential risk to the environment and the plating operators. Therefore, alternatives to formaldehyde used in electroless copper deposition have been proposed. Electroless nickel–phosphorus (Ni–P) deposits are widely used in various industries, in particular as protective and functional coatings because of their unique combination of material properties. Many of these material properties are adjustable through thermal processing when the amorphous structure of the deposits undergoes a crystalline transition process.

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