Abstract
Thin films of the noble metals Ag and Au are prospective candidates for application as electrical contacts in high temperature superconductor (HTSC) thin film devices. We present first results on intrinsic stress in Ag and Au films measured during and after their UHV deposition onto YBa2Cu3O7−x thin film substrates. At 110 K film growth proceeds by columnar grain growth with tensile stresses as huge as the tensile strength of the bulk phase. At room temperature and up to 600 K the films grow via island growth developing much smaller film stress. At temperatures above 550 K a compressive stress contribution due to interdiffusion of oxygen from the HTSC substrates into the contact films is observed.
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