Intermittent plastic flow of single crystals: central problems in plasticity: a review

Abstract

The relationships between microstructure and plastic flow properties of copper single crystals deformed at low temperatures are reviewed based on the analysis of experimental results of mechanical, structural and electrical resistivity characterisation. Electrical resistivity measurements suggest that the flow stress correlates with the average density of defects accumulated in the microstructure. The characteristic microstructural length scale that determines the flow stress corresponds closely to the size of dislocation free channels and/or cells produced during plastic flow. The correspondence between micro- and macroscopic approaches to the plastic flow has been analysed based on the behaviour of dislocation mean free path and mean slip distance and their relationship to the microstructure. Production and annihilation of nanoscale debris and point defects and their role in plastic flow and questions pertinent to the influence of microstructural instabilities on the flow stress, workhardening, storage and annihilation of lattice defects have been discussed.