Abstract
Interfacial reactions between Sn-Bi alloys of different compositions and Ni substrates at 423 K for different durations were investigated. Only one interfacial phase, Ni3Sn4, was detected despite the existence of several other intermetallic compounds (IMCs) in Ni-Sn and Ni-Bi binary systems. This observation (only Ni3Sn4 was formed at the interface) was explained as a combination of the driving force for formation of the IMC and diffusion of Ni. The change of Ni3Sn4 layer thickness as a function of annealing time, which obeys a parabolic rule, was further confirmed. The thickness of Ni3Sn4 was also found to decrease with increasing Bi content in the Sn-Bi alloy.
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