Abstract
In this study, the interfacial reaction and joint reliability of immersion Ag-plated Cu substrate with the Sn–0·7Cu (wt-%) ball–grid array (BGA) solder was investigated. During reflow, the Ag plating layer was dissolved completely into the molten Sn–Cu solder and some of the Cu layer was also dissolved into the molten solder. The dissolved Ag and Cu were precipitated as Ag3Sn and Cu6Sn5 intermetallic compounds (IMCs) in the solder matrix. Upon reflow, the Sn–Cu solder exhibits an off-eutectic reaction to produce the eutectic phase and precipitate (Cu6Sn5 and Ag3Sn). The Cu–Sn IMC layer was formed at the solder/Cu interface after reflow, and the IMC layer grew during aging treatment. During the shear tests, the failure mode switched from a bulk-related failure to an interface-related failure. After aging for 250 h, the joint failed partially at the solder/Cu6Sn5 interface. The brittle fracture was linked to the formation of thick Cu–Sn IMC layer.
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