Interfacial layer growth of ZrO 2 films on silicon

Abstract

In this work, the interfacial layer growth for both as-deposited and annealed ZrO 2 thin films on silicon is analyzed in detail by the high-resolution cross-sectional transmission electron microscope and spectroscopic ellipsometry. For as-deposited ZrO 2/SiO 2/Si, the thickness of a SiO 2-like layer at the silicon interface was found to depend on the oxygen partial pressure during deposition. At oxygen partial pressure ratio of above 50% the interfacial silicon oxide thickness increased through oxygen diffusion through the ZrO 2 film and silicon consumption at the interface. At oxygen partial pressure ratio in the range 7–50%, the visible growth of interfacial silicon oxide layer was not present. The interfacial layer for ZrO 2/Si with optimal partial pressure (15%) during annealing at 600 °C was found to be the two-layer structure composed of the ZrSi x O y overlayer and the SiO x downlayer. The formation of the interfacial layer is well accounted for diffusion mechanisms involving Si indiffusion and grain-boundary diffusion.