Interfacial interaction of in situ Cu growth on tetrasulfide self-assembled monolayer on plasma treated parylene surface

Abstract

The interfacial reactions of in situ grown Cu and functionalized parylene surfaces were examined using the x-ray photoelectron spectroscopy (XPS). It is observed that bis[3(triethoxysilane)propyl]tetrasulfide (tetrasulfide) forms a self-assembled monolayer (SAM) only on a parylene surface treated with either He plasma or N2 plasma, but not on the as-deposited parylene surface due to its lack of functional groups. The functional groups on the plasma treated parylene surface facilitate the formation of tetrasulfide SAM that subsequently improves the reactivity of parylene to Cu. The XPS spectra show a strong shift (∼1.1eV) of the S 2p peaks from a higher binding energy to a lower binding energy, which suggests the existence of an interaction between sulfide and Cu. In addition, the result of a higher XPS intensity ratio of Cu 2p3∕2∕C 1s for Cu growth on tetrasulfide SAM/plasma treated parylene surface than that of an as-deposited parylene surface indicates that the formation of tetrasulfide moiety (–SSSS–) on functionalized parylene surface leads to the increase of Cu growth rate.