Abstract
The effect of a transient thermal load on an interfacial edge crack and center crack between a ceramic‐to‐metal bond was analyzed with the use of fracture mechanics. The deformations of the crack and the strain energy release rate were calculated for the case of a ceramic layer of equal thickness to the metal, one with one‐tenth the thickness of the metal, and one with 10 times the thickness of the metal. It was determined that for an edge crack, under slow cooling conditions, the steady‐state value of G is the largest, and G is largest for equal thicknesses of ceramic and metal. For a center crack, a maximum transient G occurs which is larger than the steady‐state value and the strain energy release rate is smallest for equal thicknesses of ceramic and metal.
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