Interfacial bonding and microstructural evolution in Inconel-copper bimetallic structures fabricated by directed energy deposition-arc

Abstract

Directed Energy Deposition-Arc (DED-Arc) was utilized to fabricate Inconel-copper bimetallic structures, with the aim of improving manufacturing modes and reducing costs for rocket engine thrust chambers. In this paper, bimetallic Inconel superalloy (GH4169) and copper alloy (C18150) structures were deposited using different deposition strategies. The formation mechanisms of grain-size gradients and heterogeneous interfacial microstructural evolution were comprehensive investigated and further discussed. Both strategies produced high-quality bimetallic samples with tensile strength exceeding 260.2 MPa. Fractures occurred within the C18150 metal rather than at the interface, indicating successful interface strengthening of the bimetallic samples. Gradual gradients in grain size distribution and nano-hardness were observed across the interface. The crystal structures of C18150 were unaffected by GH4169, and no new phases were generated in the interfacial region. The crystallographic orientation relationship between Ni and Cu was determined to be [011]Cu//[011]Ni and (111)Cu//(111)Ni, and interfaces were strengthened by grain boundary and dislocation strengthening through. This work demonstrates an approach for fabricating large, high-performance bimetallic structures with tailored grain-size gradients and heterogeneous microstructures, suitable for rocket engine thrust chamber applications.