Abstract
The effects of KOH + ethylenediamine (EDA) and subsequent KMnO4 + KOH treatments on the interfacial adhesion characteristics of an electroless-plated Ni/polyimide system were investigated for flexible printed circuit board applications. The interfacial adhesion energy, evaluated from 180° peel tests during the steady-state peeling process, showed a twofold decrease after subsequent KMnO4 + KOH treatment of the pyromellitic dianhydianiline- oxydianiline polyimide surface. Atomic force microscopy and x-ray photoemission spectroscopy results clearly reveal that this decrease can be attributed to both mechanical interlocking and chemical bonding effects.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
