Abstract
The effects of KOH + ethylenediamine (EDA) and subsequent KMnO4 + KOH treatments on the interfacial adhesion characteristics of an electroless-plated Ni/polyimide system were investigated for flexible printed circuit board applications. The interfacial adhesion energy, evaluated from 180° peel tests during the steady-state peeling process, showed a twofold decrease after subsequent KMnO4 + KOH treatment of the pyromellitic dianhydianiline- oxydianiline polyimide surface. Atomic force microscopy and x-ray photoemission spectroscopy results clearly reveal that this decrease can be attributed to both mechanical interlocking and chemical bonding effects.
Published Version
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