Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag–Sn, Cu–Sn and Ni–Sn intermetallic compounds

Abstract

Standard enthalpies of formation were determined for a number of binary intermetallic compounds in the systems Ag–Sn, Cu–Sn, and Ni–Sn by means of solution calorimetry in liquid Sn in a Calvet-type microcalorimeter. For the pure elements Ag, Cu, and Ni, the limiting partial enthalpies of mixing as well as the enthalpies of solution at infinite dilution in Sn were measured at 773, 873, 973 and 1073 K. The results for the enthalpy of formation for the intermetallic compounds Ag 3Sn, Ag 4Sn, Cu 3Sn, Cu 41Sn 11, Cu 6Sn 5, Ni 3Sn-LT, Ni 3Sn 2-HT, and Ni 3Sn 4 are discussed and compared with the corresponding literature values.