Abstract
Bonding interface quality is crucial for power electronic packaging, while the alloyed Ag nanoparticle sintered joint has lower crack resistance at the interface. In this work, a sandwich structure nanoparticle film consisting of an Ag transition layer, nanoalloy layer, and Ag transition layer was developed for interface-enhanced low-temperature bonding. The optimized sandwich structure increased the shear strength of Ag-based nanoalloy sintered joints, reaching 5.6 times for Ag10Cu and 2.0 times for Ag10Pd, respectively. The low-temperature spreadability of the Ag transition layer provided a micro-nano structure and further driving force for nanoalloy sintering on the substrate. Both experimental and molecular dynamics simulation results revealed that these nanoalloy particles spread easier and realized a higher effective bonding area. This interface-enhancing strategy enables the Ag-based nanoalloy a high-reliability die-attach material with low-temperature bondability.
Published Version
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