Interface crack between a thin film and an orthotropic substrate under uniform heat flow

Abstract

An interface crack between a thin film and an orthotropic substrate under uniform heat flow is analyzed. Four thermal load parameters are proposed to describe the interface stress intensity factors based on the thermoelastic formalism with transformed function representation. The interface stress intensity factors are expressed in terms of the thermal load parameters and dimensionless coefficients. The dimensionless coefficients are shown to depend on seven material parameters and one geometric parameter. The dependence of the dimensionless coefficients on one orthotropic parameter of the film is explicitly found by means of the orthotropic rescaling technique. The effects of other material parameters on the dimensionless coefficients as the geometric parameter varies were numerically investigated using finite element analysis.