Abstract
High-performance silvered poly(meta-phenylene isophthalamide) (PMIA) fiber can be applied in antistatic, conductive, electromagnetic interference shielding and other fields, whereas achieving good interface bonding of silver layer to PMIA matrix remains a grand challenge. This paper studies a method of constructing multi-structure interface between silver layer and PMIA fiber. First, crosslinked hyperbranched polyamidoamine (HPAMAM), referred to as xHP-Qy, was introduced onto PMIA by means of a dip-coating method. Then, the modified fiber was surface metallized by silver ammonia solution and glucose solution to prepare a silver-coated fiber. The structure, morphology and properties of as-prepared materials were characterized systematically. The results show that the final fiber exhibits a low electrical resistivity (5.95 × 10−5 Ω·cm) without sacrificing the thermal stability and mechanical performance of the PMIA itself, which is attributed to the distinct antenna-shaped structure of xHP-Qy between PMIA matrix and Ag layer. In addition, the functionalized composite fiber preserves low resistivity even after subjecting harsh environment and mechanical deformation. The strategy paves a promising avenue for the fabrication of high-performance fiber with enormous potential application for electromagnetic interference shielding, electrical heating and flexible sensor materials.
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