Surface/subsurface damage mechanisms and inhibition strategies in machining of hard and brittle materials: A systematic review

Abstract

With the continuous development of modern industrial technology, hard and brittle materials are widely used in semiconductors, precision instruments, space optics, biomedicine and other fields due to their excellent physical and chemical properties. However, the processing of hard and brittle materials is difficult, and it is easy to produce damage such as surface / subsurface cracks, edge breakage, and subsurface damage during processing, which seriously affects its performance and lifetime. Therefore, the in-depth study of the machining damage mechanism of hard and brittle materials and the exploration of effective inhibition strategies are of great significance to improve the machining efficiency of hard and brittle materials, reduce costs and optimize product quality. In order to study the machining damage mechanism of hard and brittle materials in depth, the research results and advances in the machining of hard and brittle materials are summarized. It focuses on the study of hard and brittle material processing damage forms and their influencing factors. The processing mode, damage type and formation mechanism of hard and brittle materials are analyzed. In order to solve the problems of hard and brittle material processing, the strategies for suppressing interface damage in recent years have been discussed from four aspects: tool optimization, energy field compounding, machining process, and modification of machining materials. The research trend of hard and brittle material machining is envisioned, which provides an important reference value for realizing efficient and low-damage machining of hard and brittle materials.