Integration technology of heterogenous components for microsytems

Abstract

Microelectromechanical system (MEMS) technologies have produced various high-value-added products and devices on the basis of heteroginous integration technology including LSI integration. On the other hand, recent LSI has been miniaturized according to scaling law. LSI has been fabricated by standardized process, and its production requires huge facilities. On the other hand, the principle, structure and size of MEMSs are different, and the standardization of the process is difficult. In MEMSs, various kinds of materials including nanomaterials are used in comparison with LSI, also specific fabrication technologies different from that of LSI are used. Consequently, monolithic fabrication of MEMS and LSI, i.e. integration of both MEMS and LSI on a substrate, become difficult. The fabrication of recent LSI needs huge costs, and the researches on integration of MEMS and LSI (LSI-MEMS) becomes difficult. Successful devices are only high-volume production including inertia sensors and pressure sensors, but high volume production is not always needed for MEMSs. Microelectromechanical system (MEMS) technologies have produced various high-value-added products and devices on the basis of heteroginous integration technology including LSI integration. Also this technology can miniaturize sensors or various systems, which opens new applications to ubiquitous sensing and network sensor. At Tohoku University, we started researches of LSI-MEMS based on “Shared wafer” for additive MEMS process to reduce the development cost, which is conducted in program “Innovation center for fusion of advanced technologies”[1]. In this talk, recent progress of the research based on “Shared wafer”, also related researches on integration technologies and devices are presented.