Abstract
This paper outlines lateral power devices in Power BiCMOS (PBC) technologies where increasing application circuit complexity is driving the need to maintain compatibility with advanced CMOS technology and integration by parts remains a challenge. Different device strategies and process roadmaps are required to maintain competitive products. The need for compatibility with these leading edge CMOS technologies complicates the push for reduced complexity. Product application drivers, device styles combined with process integration challenges and methods, and the future problems with shrinking geometry are discussed.
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