Integration of polymer microfluidic channels, vias, and connectors with silicon photonic sensors by one-step combined photopatterning and molding of OSTE

Abstract

We demonstrate a method for the fast and simple packaging of silicon sensors into a microfluidic package consisting of the recently introduced OSTE polymer. The microfluidic layer is first microstructured and thereafter dry-bonded to a silicon photonic sensor, in a process compatible with wafer-level production, and with the entire packaging process lasting only 10 minutes. The fluidic layer combines molded microchannels and fluidic (Luer) connectors with photopatterned through-holes (vias) for optical fiber probing and fluid connections. All the features are fabricated in a single photocuring step. We report measurements with an integrated silicon photonic Mach-Zehnder interferometer refractive index sensor packaged by these means.