Abstract
This paper presents a monolithically integrated multi-sensor system for the intelligent data carrier(IDC). The system includes a three-dimensional accelerometer, pressure sensor, temperature sensor and humidity sensor as well as the peripheral circuitry for each sensor on one chip. The peripheral circuitry was designed to combine them to one-chip microprocessor with A/D converter. The monolithic multi-sensor chip was realized using an SOI wafer, where the Deep-RIE bulk-micromachining process and bipolar IC process were used for sensor device fabrication and circuit fabrication, respectively.
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